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Technology Enhances Manufacturing Quality  

 

September 16th, 2014

 

As product designs continue to pack more features and technology into smaller form factors, manufacturers face ever more difficult challenges in providing quality electronic manufacturing.

 

For the most part, gone are the days of simple double sided, through hole PC boards that could be built with the most basic insertion and wave solder equipment. Todays products with 0201, 01005 and smaller SMT components, dense BGA's, FPGA and other challenging to place components require special manufacturing technology, processes and discipline.

 

ABX Engineering, Inc. is a 29-year-old ISO 9001-2008 and 13485-2003 approved contract electronics manufacturer supporting NPI, medium to large sized production, providing coast to coast coverage with offices in San Francisco and San Diego.

 

ABX offers customers a variety of manufacturing equipment and technologies to provide quality manufacturing for the most challenging to build products. Available equipment includes state of the art Siemens pick & place lines, Vitronics Solteck XPM2 Reflow Ovens (RoHS Compliant) and Nu/Clean PolySMT 318 Aqueous Cleaner supported by Closed Loop DI Water Treatment Systems as well as optional Saponifier Green Chemical Cleaning processes.

 

Many PCBA designs use a combination of SMT and through hole technology. To support this production ABX has the RPS Rhythm Selective Soldering System. The Rhythm Selective Soldering System is designed for high mix, high value, low to high volume PCB production environments. The Rhythm Soldering System can be programmed in minutes to handle basic to complex through-hole and mixed SMYT soldering requirements. At the heart of the Rhythm is the solder management system, designed for lead and lead-free applications, it features servo motor motion control for speed, accuracy and repeatability, independently heated Nitrogen for superior soldering performance and nitrogen inerted quick-change solder nozzles for industry-leading selective soldering keep-away (less than 1.5mm) and lead protrusion clearance (6 mm).

 

To further enhance the manufacturing technologies supporting advanced production designs ABX utilizes the Dage XD7500VR X-ray Inspection System. The Dage XD7500VR X-ray Inspection System features 1,500 X Geometric Magnification (7,000 X system magnification) and will support Maximum Board Size up to 20” x 17.5” (508 x 444 mm) The Dage XD7500VR X-ray Inspection System supports both automated and manual BGA analysis including diameters, void percentage, area, roundness and other attributes. The XD7500VR also supports automated QFN Analysis, detecting void percentages, open joints and other manufacturing properties.

 

Manufacturing technology and processes are critical in producing a product that will provide long term reliability in harsh ruggedized environments such as Aviation, undersea ROV's, automotive, military, industrial, lighting and other extreme environments. ABX is a leading CM in producing higher technology products, from circuit boards to complete turn key systems, manufacturing for industries including medical, aviation, broadcast, commercial, industrial, research and other customers.

 

For more information on ABX Engineering contact,

 

 

Mr. Brian Helm

875 Stanton Road

Burlingame, California 94010-1503

Phone: 650-552-2322

Email: bph@abxengr.com

www.abxengineering.com

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