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ABX adds Koh Young Technology KY8030-3 3D In-Line Solder Paste Inspection Equipment

March 1st, 2019

In 2019 ABX Engineering celebrates over 33 years of serving our customers offering full turnkey manufacturing, from new product introduction through volume turnkey manufacturing and Electromechanical Assembly.

To further enhance ABX’s SMT capabilities, ABX has added Koh Young Technology KY8030-3 3D In-Line Solder Paste Inspection (SPI) equipment

Typically over 70% of the defects in the SMT process are caused during solder printing. By optimizing the printing process, the SMT line realizes maximum yields in downstream stages of pick & place and reflow and overall product quality as related to component placement and soldering is improved.

The Koh Young Technology KY8030-3 is part of a closed loop with the printing process monitoring production status with real time communications between the solder paste printer and the SPI.

ABX has been able to maintain a 99.7% plus customer pass rate for PCBA’s, with the addition of the Koh Young Technology KY8030-3 ABX will continue to strive to achieve a 100% customer acceptance/pass rate for ABX manufactured PCBA’s!

With over 33 years of experience in materials management, high technology production and test, ABX is a leading CM in producing higher technology products, from circuit boards to complete turn-key systems, conducting manufacturing for industries including medical, life-sciences, aviation, lighting, broadcast, commercial, industrial, research and other customers.